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FR Consumables
Special Purpose Laminates
Besides our standard products we offer some materials for special applications. If you do not find below a suitable product for your application, please contact us.
Consumables
Anodized Aluminium
for Front Panel Engraving, nature or black. Size approx. 500 x 1000 x 1.5 mm
Technical glass fibre laminate no copper clad, no photoresist. Format: 510 x 1150 x 1.55 mm
Technical glass fibre laminate
no copper clad, no photoresist, size: 510 x 1150
x1.55 mm
Drill backing boards
Drill backing boards for drilling pcbs e.g. with the
BUNGARD CCD.
in stock:
- 500 x 1000 x 2.5 mm
- 500 x 1000 x 6 mm
- 245 x 330 x 6 mm
Teflon
There is an almost endless product variety in high frequency application. That is why we abstain to keep an expensive stock with Teflon products. With pleasure we will coat your material perfectly fitting to your application with our pre-sensitizing service.
Multilayer Consumables
Prepregs (250 x 350 x 0.2 mm)
outer layer (FR4 250 x 350 x 0.3 mm 18/00)
inner layer (FR4 250 x 350 x 0.5 mm 18/18)
separation foil
(packing size for Prepregs and separation foil 50
pcs. each)
Copper clad laminates
FR4, CEM 1, FR2, without photoresist. Approvals and standards as for pre-sensitized boards. The copper surface is not yet brushed. FR 2 is especially suited for isolation milling purposes. Routers and drills will last remarkably longer because of the lack of fibre glass within this product.
These sizes are on stock:
| FR4 510 x 1150 mm | Copper clad 5 μm double sided | thickness 1.5 mm |
| Copper clad 18 μm single sided or double sided |
thickness 0.5, 0.8, 1.0 1.5 mm | |
| Copper clad 35 μm single sided or double sided |
thickness 0.5, 0.8, 1.0 1.5, 2.0, 2.5 mm | |
| Copper clad 70 μm single sided or double sided |
thickness 0.5, 1.0 1.5, 2.0, 2.5 mm | |
| Copper clad 105 μm single sided or double sided |
thickness 1.5 mm | |
| FR4 Blue / Black * * FR4 Black double sided stock clearance sale |
Copper clad 35 μm single sided or double sided |
thickness 1.5 mm |
| CEM1 | Copper clad 35 μm single sided | thickness 1.5 mm |
| FR2 | Copper clad 35 μm single sided | thickness 1.5 mm |
FR4 Thin Laminate
in 0.125 mm and 0.2 mm thickness
For semiflex application and multilayer!
The Bungard semiflex base material combines the advantages of the simple processing of the Bungard standard base material with flexibility for special applications.
Board formats:
- 100 x 160 mm 35 μm Cu
- 210 x 300 mm 35 μm Cu
- 510 x 1150 mm 35 μm Cu
Please note that we sell boards of 100x160 only in units of 35 and 210x300 only in units of 8 boards.
Unterlagen für das Bohren von Leiterplatten z. B. mit der Bungard CCD sind in folgenden Formaten lieferbar:
- 500 x 1000 x 2.5 mm
- 500 x 1000 x 6 mm
- 245 x 330 x 6 mm
Für die Multilayerherstellung haben wir Prepregs (250 x 350 x 0.2 mm), Decklagen (FR4 250 x 350 x 0.3 mm 18/00), Innenlagen (FR4 250 x 350 x 0.5 mm 18/18) und Trennfolien im Sortiment (Gebindegröße bei Prepregs und Trennfolie je 50 St.)
